F25

With the F25 coordinate measuring machine, ZEISS offers a system that meets the extreme demands of quality assurance for size, form and position of microsystem parts. Microsystem components are used in automotive and medical parts. They are essential for highly accurate control processes. Their reliability is determined by the precision with which quality assurance ensures the function of these tiny parts.

Key Features

The ultra-precise kinematics combined with the highly accurate measuring system enable measuring uncertainty of 250 nm at a resolution of 7.5 nm.
Time-tested CALYPSO measuring software used on other large coordinate measuring machines.

Machine Technology

Flexible measuring with multi-sensor technology: contact and optical measuring with one system
Contact, passive measuring scanning sensor based on silicon-chip technology with integrated Piezo-resistive elements
ViSCAN camera sensor based on an objective lens used in ZEISS microscopy for 2D measurements
An additional camera aids visualization during probing and simplifies learn programming.

Options

Sensitive 3D micro-stylus for stylus diameters of 50 – 500 μm and stylus tip diameters of 100 – 700 μm

Dimensions

Measuring Range (in mm)
100 x 100 x 100